Brief introduction of vacuum single crystal silicon wafer sandblasting machine:

Application: single crystal silicon sand blasting, 3 inches, 4 inches

The belt conveyor is used to transport the workpiece, and the operation speed can be adjusted according to the requirements of sand blasting process; the silicon chip can be absorbed by vacuum to prevent the silicon chip from flying.

Low crushing rate, adjustable thinning, controllable sandblasting size.

Adopt PLC or general electrical control system, main parts adopt high quality products at home and abroad, with high operation reliability;

With independent sand dust separator, the separation effect is good, the sand material is supplied circularly, suitable for all kinds of sand materials under 300 mesh, and the sand material has good circulation stability and small loss.

Using high wear-resistant boron carbide or ceramic nozzle, the number of spray guns can be designed 10-20 according to the processing needs, which can meet the needs of a large number of rapid processing of different products;

Independent bag or cartridge type dust removal system, good dust extraction and ventilation effect (optional: pulse filter type dust removal).

This machine is specially used for sand blasting of polycrystalline silicon and monocrystalline silicon. It is characterized by high efficiency, simple operation, small maintenance and high automation. It is a common equipment in the solar energy industry.

Number of spray guns: 10-18

Channel size: 250mm

Conveying speed: 0-1.5m adjustable

Total power: 13kw (excluding compressed air power)

Gas consumption: 6-m3 / min

This machine can also be used for sand blasting of similar products.

The specific parameters can be customized according to the product requirements of customers.